Materials Informatics Technique for Designing Strong-Adhesion Interfaces in Electronics Devices
نویسندگان
چکیده
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ژورنال
عنوان ژورنال: Transactions of The Japan Institute of Electronics Packaging
سال: 2020
ISSN: 1883-3365,1884-8028
DOI: 10.5104/jiepeng.13.e19-006-1